EP2SGX60EF1152I5N vs EP2SGX60DF780I4N Vergleich

Detaillierter Direktvergleich von EP2SGX60EF1152I5N von Intel und EP2SGX60DF780I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60EF1152I5N EP2SGX60DF780I4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Unknown NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $1.310,00
Device Type Field Programmable Gate Array (FPGA) —
Family Stratix II GX Stratix II GX
Logic Cells 60,440 —
Logic Blocks 60,440 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.2 V —
Internal Frequency 717 MHz —
Reported Internal Frequency 609.76 MHz —
Maximale Taktfrequenz 622.08 MHz —
Betriebstemperaturbereich -40 °C to 85 °C —
Gehäuse 1152-ball BGA FBGA-780 (DF)
Package Type FC-FBGA —
Package Dimensions 23 x 23 mm —
Terminal Pitch 1 mm —
Number of Terminals 1152 —
Terminal Form Ball —
Temperature Grade Industrial —
Propagation Delay [DATA_NEEDED: propagation delay] —
Configuration Memory [DATA_NEEDED: configuration memory type and size] —
I/O Count [DATA_NEEDED: user I/O count] —
Transceiver Count [DATA_NEEDED: transceiver count] —
RoHS-Status unknown —
REACH Status unknown —
Logic Elements — 60,440
Logic Array Blocks (LABs) — 3,022
User I/O Pins — 364
Embedded Transceivers — Yes (multi-gigabit)
Transceiver Data Rate (max) — 6.375 Gbps
Core Voltage — 1.2 V
Package Body Size — 29 x 29 mm
Ball Pitch — 1.0 mm
Betriebstemperatur — -40C to +100C (industrial)
Lead Free — Yes
RoHS — Compliant
Maximum Internal Frequency — 732.1 MHz

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