EP2SGX90EF1152C3N vs EP2SGX90EF1152C3 Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152C3N von Intel und EP2SGX90EF1152C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX90EF1152C3N | EP2SGX90EF1152C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.280,00 | $1.180,00 |
| Series | Stratix II GX | Stratix II GX |
| Family | Stratix II GX | — |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | 4548 |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | 12 |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Operating Frequency (max) | 816.9 MHz | — |
| Betriebstemperatur | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | C3 |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements (LEs) | — | 90,960 |
| Total RAM Bits | — | 4,520,448 (4.5 Mbit) |
| User I/O Count | — | 558 |
| Gehäuse | — | 1152-FBGA (FineLine BGA) |
| Transceiver Data Rate | — | 3.125 - 6.375 Gbps |
| Number of PLLs | — | 4 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| Core Voltage (VCCINT) | — | 1.2 V |
| RoHS-Status | — | [DATA_NEEDED: RoHS compliance status] |