EP2SGX90EF1152C3N vs EP2SGX90EF1152I2N Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152C3N von Intel und EP2SGX90EF1152I2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX90EF1152C3N | EP2SGX90EF1152I2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.280,00 | $1.320,00 |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | 558 |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Frequency (max) | 816.9 MHz | — |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | — |
| Temperature Grade | C3 (Commercial) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements | — | 90,960 |
| Logic Array Blocks (LABs) | — | 4,548 |
| Total Embedded RAM Bits | — | 4,520,448 bits |
| Gehäuse | — | 1152-BBGA (FC-FBGA, flip-chip) |
| Operating Temperature Grade | — | Industrial (I2) |
| Process Node | — | 90 nm |
| Transceivers | — | Up to 12 high-speed serial channels (family spec) |
| RoHS-Status | — | Compliant |
| Lead-Free | — | Yes |
| Lebenszyklusstatus | — | Active (Stratix II GX family) |