EP2SGX90EF1152C4N vs EP2SGX90EF1152C3 Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152C4N von Intel und EP2SGX90EF1152C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX90EF1152C4N | EP2SGX90EF1152C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $695,00 | $1.180,00 |
| Family | Stratix II GX | — |
| Logic Elements (LE) | 90,960 | — |
| LABs/CLBs | 4,548 | — |
| Total RAM Bits | 4,520,448 bits | 4,520,448 (4.5 Mbit) |
| User I/O Count | 558 | 558 |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 1.2 V | — |
| Process Node | 90 nm | — |
| Transceivers | Up to 20 channels, 6.375 Gbps per channel | — |
| Speed Grade | C4 | C3 |
| Betriebstemperatur | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Gehäuse | 1152-BBGA / FC-FBGA-1152 | 1152-FBGA (FineLine BGA) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | MSL-3 / MS-034AAR-1 (per package outline) | — |
| Lead-Free / RoHS | Lead free; RoHS compliance per JEDEC | — |
| Series | — | Stratix II GX |
| Logic Elements (LEs) | — | 90,960 |
| Number of LABs/CLBs | — | 4548 |
| Number of Transceivers | — | 12 |
| Transceiver Data Rate | — | 3.125 - 6.375 Gbps |
| Number of PLLs | — | 4 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | 90 nm CMOS |
| RoHS-Status | — | [DATA_NEEDED: RoHS compliance status] |