EP2SGX90EF1152I5 vs EP2SGX90EF1152C4N Vergleich
Detaillierter Direktvergleich von EP2SGX90EF1152I5 von Intel und EP2SGX90EF1152C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX90EF1152I5 | EP2SGX90EF1152C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.320,00 | $695,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| Configurable Logic Blocks (CLBs) | 90,960 | — |
| Embedded Memory | [DATA_NEEDED: total bits] | — |
| Transceivers | Up to 20 multi-gigabit transceivers at 6.375 Gbps | Up to 20 channels, 6.375 Gbps per channel |
| Combinatorial Delay | 4.006 ns | — |
| Maximum Internal Clock Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Gehäuse | 1152-ball FineLine BGA (FBGA-1152) | 1152-BBGA / FC-FBGA-1152 |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Temperature Grade | Industrial (-40C to +100C ambient) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | — |
| Logic Elements (LE) | — | 90,960 |
| LABs/CLBs | — | 4,548 |
| Total RAM Bits | — | 4,520,448 bits |
| User I/O Count | — | 558 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage | — | 1.2 V |
| Process Node | — | 90 nm |
| Speed Grade | — | C4 |
| Betriebstemperatur | — | Commercial (0C to +85C) |
| MSL-Level | — | MSL-3 / MS-034AAR-1 (per package outline) |
| Lead-Free / RoHS | — | Lead free; RoHS compliance per JEDEC |