EP2SGX90FF1508C4ES vs EP2SGX90FF1508C3ES Vergleich

Detaillierter Direktvergleich von EP2SGX90FF1508C4ES von Intel und EP2SGX90FF1508C3ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX90FF1508C4ES EP2SGX90FF1508C3ES
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.095,00 $1.340,00
Family Stratix II GX Stratix II GX
Logic Elements / Cells 90960 —
Logic Array Blocks (LABs) 4828 4,828
Configurable Logic Blocks (CLBs) 4828 —
Maximum Internal Frequency 717 MHz 816.9 MHz
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage (VCCINT) 1.2 V (1.15 V to 1.25 V) —
Transceivers 12 channels at up to 6.375 Gbps —
Embedded Memory 4828 Kbit TriMatrix memory blocks —
Embedded Multipliers 252 (18x18) —
User I/O Pins 650 (approx.) —
Package Type 1508-ball FC-FBGA —
Package Code MS-034AAR-1, FBGA-1508, 40 x 40 mm, 1 mm pitch —
Betriebstemperatur 0 C to 85 C (Commercial / Extended) —
Grade Engineering Sample (ES) —
RoHS-Status Compliant (verify by date code) [DATA_NEEDED: rohs]
Logic Elements — 90,960
Embedded Memory (TriMatrix) — 4,520,448 bits
Total RAM Bits — 4,520,448
Core Supply Voltage — 1.2 V
DSP Blocks — Yes (dedicated multiplier blocks)
Embedded Transceivers — Up to 3.125 Gbps multi-gigabit transceivers
Global Clock Networks — Up to 16
Regional Clock Networks — Up to 32 per device region
Gehäuse — 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch
Montageart — Surface Mount
Configuration Interface — JTAG / EPCS serial flash / Passive parallel
Operating Temperature Grade — Commercial / Industrial (per part suffix)

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