EP3C16E144I7N vs EP3C16E144I7 Vergleich

Detaillierter Direktvergleich von EP3C16E144I7N von Intel und EP3C16E144I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16E144I7N EP3C16E144I7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Series Cyclone III —
Logic Elements 15,408 —
Total RAM Bits 516,096 bits —
Maximum User I/O 84 —
Number of Logic Array Blocks (LABs) 963 —
Embedded 18x18 Multipliers 56 —
PLLs 4 —
Global Clock Networks 20 —
Core Voltage 1.2 V —
I/O Bank Voltage Support 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V —
Betriebstemperatur -40C to +100C (industrial, junction) —
Speed Grade 7 (I7) —
Gehäuse 144-LQFP Exposed Pad (EQFP-144) 144-LQFP Exposed Pad
Montageart Surface Mount Surface Mount
Lead-Free / RoHS Yes (lead-free finish, RoHS compliant per manufacturer product page) —
Process Technology 65 nm low-power CMOS —
Configuration Scheme Active serial, passive serial, JTAG —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Logic Cells — 15,408
I/O Count — 84
Package Code — LFQFP
Package Body Size — 20 x 20 mm
Package Pitch — 0.40 mm
Pin-Anzahl — 144
Terminal Type — Gull wing
Package Shape — Square
Temperature Grade — Industrial
Embedded Memory — [DATA_NEEDED: embedded memory specification]
Core Supply Voltage — [DATA_NEEDED: core supply voltage]
I/O Supply Voltage — [DATA_NEEDED: I/O supply voltage]
Betriebstemperaturbereich — [DATA_NEEDED: operating temperature range]
Configuration Interface — [DATA_NEEDED: configuration interface]
RoHS-Status — [DATA_NEEDED: RoHS status]

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