EP3C16F484C8 vs EP3C16F484I7 Vergleich

Detaillierter Direktvergleich von EP3C16F484C8 von Intel und EP3C16F484I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16F484C8 EP3C16F484I7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Programmable Logic Bits 516,096 bits —
Logic Elements 15,408 logic elements 15,408
I/O Count 346 I/O —
Versorgungsspannung 1.2 V —
Gehäuse 484-pin FBGA 484-ball FineLine BGA (F484)
Terminal Count 484 terminals —
Terminal Form Ball —
Package Shape Rectangular —
Montageart Surface Mount Surface Mount
Minimum Operating Temperature [DATA_NEEDED: minimum operating temperature] —
Maximum Operating Temperature [DATA_NEEDED: maximum operating temperature] —
Core Frequency [DATA_NEEDED: maximum core frequency] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
Memory Blocks [DATA_NEEDED: embedded memory block count] —
Block RAM Capacity [DATA_NEEDED: embedded block RAM capacity] —
PLL Count [DATA_NEEDED: PLL count] —
Configuration Method [DATA_NEEDED: configuration methods] Passive Serial, Fast Passive Parallel, Active Serial, JTAG
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
Family — Cyclone III
Manufacturer — Intel (formerly Altera)
Logic Array Blocks (LABs) — 963
Total Embedded Memory — 516,096 bits (63 KB)
Embedded Memory Blocks — M9K x 56
Embedded 18x18 Multipliers — 56
User I/Os — 346
General-Purpose PLLs — 4
Betriebstemperatur — -40C to +100C (industrial)
Speed Grade — 7 (fastest commercial/industrial)
Process Node — 60 nm TSMC low-power
RoHS-Status — Compliant

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern