EP3C16F484I7 vs EP3C16F484C8 Vergleich

Detaillierter Direktvergleich von EP3C16F484I7 von Intel und EP3C16F484C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16F484I7 EP3C16F484C8
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Family Cyclone III —
Manufacturer Intel (formerly Altera) —
Logic Elements 15,408 15,408 logic elements
Logic Array Blocks (LABs) 963 —
Total Embedded Memory 516,096 bits (63 KB) —
Embedded Memory Blocks M9K x 56 —
Embedded 18x18 Multipliers 56 —
User I/Os 346 —
General-Purpose PLLs 4 —
Gehäuse 484-ball FineLine BGA (F484) 484-pin FBGA
Betriebstemperatur -40C to +100C (industrial) —
Speed Grade 7 (fastest commercial/industrial) —
Process Node 60 nm TSMC low-power —
Configuration Method Passive Serial, Fast Passive Parallel, Active Serial, JTAG [DATA_NEEDED: configuration methods]
RoHS-Status Compliant —
Montageart Surface Mount Surface Mount
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Programmable Logic Bits — 516,096 bits
I/O Count — 346 I/O
Versorgungsspannung — 1.2 V
Terminal Count — 484 terminals
Terminal Form — Ball
Package Shape — Rectangular
Minimum Operating Temperature — [DATA_NEEDED: minimum operating temperature]
Maximum Operating Temperature — [DATA_NEEDED: maximum operating temperature]
Core Frequency — [DATA_NEEDED: maximum core frequency]
I/O Standard — [DATA_NEEDED: supported I/O standards]
Memory Blocks — [DATA_NEEDED: embedded memory block count]
Block RAM Capacity — [DATA_NEEDED: embedded block RAM capacity]
PLL Count — [DATA_NEEDED: PLL count]
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
REACH Compliance — [DATA_NEEDED: REACH compliance status]

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern