EP3C16U256C8N vs EP3C5U256C6N Vergleich
Detaillierter Direktvergleich von EP3C16U256C8N von Intel und EP3C5U256C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16U256C8N | EP3C5U256C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $48,40 | $25,40 |
| Family | Cyclone III | — |
| Logic Elements | 15,408 | 5,136 |
| Total Memory Bits | 516,096 bits | — |
| Embedded Multipliers (18 x 18) | 56 | — |
| PLLs | 4 | — |
| Maximum User I/O | 168 | — |
| Gehäuse | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) | 256-UBGA (Ultra FineLine BGA) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 65 nm low-power | 60 nm low-power CMOS |
| Speed Grade | 8 (C8, commercial) | C6 |
| Betriebs-Sperrschichttemperatur | -40 °C to +85 °C | — |
| Configuration Modes | JTAG, AS, PS, FPP | AS, PS, JTAG, Fast Passive Parallel |
| Montageart | Surface Mount (BGA, requires microvia PCB) | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant (Pb-free) | — |
| Series | — | Cyclone III |
| Device Family | — | Cyclone III FPGA |
| Logic Array Blocks (LABs) | — | 321 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lead Free / RoHS | — | Yes / Compliant |