EP3C25F324C7N vs EP3C25F324C8N Vergleich
Detaillierter Direktvergleich von EP3C25F324C7N von Intel und EP3C25F324C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324C7N | EP3C25F324C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $27,10 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | — |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | — |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.2 V | — |
| Gehäuse | 324-ball FBGA | 324-BGA (FineLine) |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Montageart | Surface Mount | Surface Mount |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Family | — | Cyclone III |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Number of I/O | — | 215 |
| Supply Voltage - Core | — | 1.2 V |
| Betriebstemperatur | — | 0 C to +85 C (commercial, suffix C) |
| Speed Grade | — | 8 |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |