EP3C25F324C8 vs EP3C25F324I7N Vergleich
Detaillierter Direktvergleich von EP3C25F324C8 von Intel und EP3C25F324I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324C8 | EP3C25F324I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $23,10 | $58,20 |
| Series | Cyclone III | — |
| Logic Elements | 24,624 LE | — |
| Logic Array Blocks | 1,539 LABs | — |
| Embedded Memory | 608,256 bits | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded Multipliers | 66 (18 x 18) | — |
| User I/Os | 215 | — |
| PLLs | 4 | 4 |
| Process Technology | 65 nm CMOS, SRAM-based | 65 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | 8 (commercial) | 7 (slower speed grade, lower power) |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | -40C to +100C (Industrial) |
| Gehäuse | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA (Fine-Pitch BGA) |
| Montageart | Surface Mount (BGA) | — |
| Maximum Internal Clock | 402 MHz | — |
| RoHS-Status | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) | Compliant |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| Global Clock Networks | — | 20 |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Lead-Free | — | Yes |
| MSL-Level | — | 3 (168 hours) |