EP3C25F324I7 vs EP3C25F324C8N Vergleich
Detaillierter Direktvergleich von EP3C25F324I7 von Intel und EP3C25F324C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324I7 | EP3C25F324C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $64,80 | $27,10 |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Logic Array Blocks (LABs) | 1,539 | — |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Betriebs-Sperrschichttemperatur | -40 °C to +100 °C (industrial) | — |
| Gehäuse | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-BGA (FineLine) |
| Montageart | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Family | — | Cyclone III |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Number of I/O | — | 215 |
| Supply Voltage - Core | — | 1.2 V |
| Betriebstemperatur | — | 0 C to +85 C (commercial, suffix C) |
| Speed Grade | — | 8 |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |