EP3C25F324I7N vs EP3C25F324C6N Vergleich
Detaillierter Direktvergleich von EP3C25F324I7N von Intel und EP3C25F324C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324I7N | EP3C25F324C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,20 | $62,30 |
| Family | Cyclone III | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LEs) | 24,624 | — |
| Embedded Memory | 608,256 bits (66 M9K blocks of 9 Kbits each) | — |
| Embedded 18x18 Multipliers | 66 | — |
| Maximum User I/O Pins | 215 | — |
| LVDS Pairs | 66 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Global Clock Networks | 20 | — |
| Process Technology | 65 nm | TSMC 65 nm low-power (LP) |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage Range | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) | — |
| Gehäuse | 324-ball FBGA (Fine-Pitch BGA) | 324-BGA (FBGA-324), fine-pitch |
| Betriebstemperatur | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Speed Grade | 7 (slower speed grade, lower power) | C6 (commercial) |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| MSL-Level | 3 (168 hours) | — |
| Series | — | Cyclone III |
| Logic Elements (LE) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory Blocks | — | M9K blocks, 66 total |
| Embedded Multipliers | — | 66 (18x18) |
| DSP Blocks | — | 66 dedicated 18x18 multipliers |
| User I/O Pins | — | 215 |
| Number of I/O Banks | — | 8 |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |
| Montageart | — | Surface Mount |