EP3C40F324I7N vs EP3C25F324C8N Vergleich
Detaillierter Direktvergleich von EP3C40F324I7N von Intel und EP3C25F324C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F324I7N | EP3C25F324C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,10 | $27,10 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Logic Array Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Total Memory Bits | 1,161,216 bits | 608,256 bits |
| Embedded Multipliers (18x18) | 126 | — |
| General-Purpose PLLs | 4 | — |
| Maximum User I/O | 195 | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Betriebstemperatur | -40 C to +100 C (Industrial) | 0 C to +85 C (commercial, suffix C) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm low-power CMOS (TSMC) | — |
| Gehäuse | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 2.2 mm height | 324-BGA (FineLine) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Number of I/O | — | 215 |
| Supply Voltage - Core | — | 1.2 V |
| Speed Grade | — | 8 |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |