EP3C40F780C7N vs EP3C40F780I8N Vergleich
Detaillierter Direktvergleich von EP3C40F780C7N von Intel und EP3C40F780I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F780C7N | EP3C40F780I8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $145,40 | $192,00 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 LE | — |
| Total RAM Bits | 1,161,216 bits | — |
| Embedded Multipliers | 126 (18x18) | — |
| User I/Os | 535 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (F780) |
| Speed Grade | 7 (C7, commercial) | — |
| Process Node | 65 nm TSMC low-power | — |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Method | JTAG, Active Serial, Passive Serial | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Moisture Sensitivity Level | MSL3 (per J-STD-020) | — |
| Device Logic Elements | — | 39,600 |
| Logic Array Blocks (LABs/CLBs) | — | 2,475 |
| Embedded Memory (bits) | — | 1,161,216 |
| Embedded Memory (Kbits) | — | 1,134 |
| Embedded Multipliers (18x18) | — | 126 |
| Number of PLLs | — | 4 |
| User I/O Pins | — | 535 |
| I/O Banks | — | 20 |
| Nominal Core Supply Voltage | — | 1.2 V (1.15 V to 1.25 V) |
| Package Ball Pitch | — | 1.0 mm |
| Process Technology | — | TSMC 65 nm low-power CMOS |
| Operating Temperature Grade | — | Industrial (-40 °C to +100 °C junction) |
| Configuration Modes | — | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel |
| RoHS-Status | — | Compliant |
| MSL-Level | — | 3 |
| Montageart | — | Surface Mount (BGA) |