EP3C40F780C8N vs EP3C40F780I7N Vergleich
Detaillierter Direktvergleich von EP3C40F780C8N von Intel und EP3C40F780I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F780C8N | EP3C40F780I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $64,85 | $92,50 |
| Series | Cyclone® III | Cyclone III |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | — |
| Number of LABs/CLBs | 2,475 | — |
| Embedded Memory Blocks | M9K x 126 | — |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | — |
| Number of PLLs | 4 | — |
| Maximum User I/Os | 535 | — |
| Number of I/O Banks | 9 | — |
| Core Voltage | 1.15V to 1.25V | 1.2 V |
| Betriebstemperatur | 0°C to +85°C (Commercial) | -40C to +100C (industrial) |
| Speed Grade | 8 (C8) | 7 |
| Gehäuse | 780-ball FBGA, 1.0mm pitch | 780-ball FBGA (F780) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Process Technology | 65nm TSMC low-power | 65 nm |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 39,600 |
| Embedded Memory | — | 1,161,216 bits (126 M9K blocks) |
| Embedded Multipliers | — | 126 (18x18) |
| User I/O Pins | — | 535 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |