EP3C55F484C7 vs EP3CLS70F484C7 Vergleich
Detaillierter Direktvergleich von EP3C55F484C7 von Intel und EP3CLS70F484C7 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3C55F484C7 - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
EP3C55F484C7 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3C55F484C7 | EP3CLS70F484C7 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,95 | $148,75 |
| Device Family | Cyclone III | — |
| Logic Elements (LE) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,495 | — |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K blocks) | 260 blocks of 9 Kbit each | — |
| Embedded 18x18 Multipliers | 156 | — |
| Maximum User I/Os | 327 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Internal Operating Frequency (max) | 472 MHz | — |
| Process Technology | 65 nm TSMC low-k CMOS | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Gehäuse | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) | 484-pin FBGA (FineLine BGA) |
| Operating Temperature Grade | Commercial (0 °C to +85 °C) - C7 speed grade | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant (lead-free FBGA) | Compliant |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Configuration Memory Type | SRAM (volatile, requires external flash) | — |
| Family | — | Cyclone III LS |
| Logic Elements | — | 70,208 LE |
| Adaptive Logic Modules (ALMs) | — | 27,808 ALM |
| Embedded Memory | — | 2.93 Mbit (M9K blocks) |
| 18x18 Hardware Multipliers | — | 278 |
| Maximum User I/O | — | 294 |
| Global Clocks | — | 20 |
| Betriebstemperatur | — | 0 C to +70 C (commercial, C7 grade) |
| Maximum Internal Frequency | — | 437.5 MHz |
| Process Node | — | 65 nm TSMC low-power |
| Packaging | — | Tray |
| Configuration Modes | — | JTAG, AS, AP, PS |