EP3C55F484I7 vs EP3C55F484C6N Vergleich
Detaillierter Direktvergleich von EP3C55F484I7 von Intel und EP3C55F484C6N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F484I7 | EP3C55F484C6N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $175,54 | $148,70 |
| Series | Cyclone III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | — |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | — |
| Betriebstemperatur | -40 °C to +100 °C (Industrial grade, I-suffix) | — |
| Gehäuse | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Lead-Free, RoHS Compliant | — |
| MSL-Level | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | 65 nm |
| Number of Logic Elements | — | 55856 |
| Number of User I/O | — | 327 |
| Total RAM Bits | — | 2396160 |
| Core Supply Voltage | — | 1.2 V |
| Gehäuse / Bauform | — | FBGA-484, 23 x 23 mm |
| Ball Count | — | 484 |
| Ball Pitch | — | 1 mm |
| Package Height | — | 2.60 mm |
| Speed Grade | — | 6 (C6) |
| Betriebstemperaturbereich | — | 0°C to +85°C |
| Maximum Internal Frequency | — | 472 MHz |
| Lead-Free / RoHS | — | Lead-free (N suffix) |