EP3C55F780C6N vs EP3C55F780C7N Vergleich
Detaillierter Direktvergleich von EP3C55F780C6N von Intel und EP3C55F780C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C6N | EP3C55F780C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,10 | $138,31 |
| Series | Cyclone III | — |
| Family | Cyclone III FPGA | Cyclone III |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Memory (Kb) | 2,340 Kb | — |
| Embedded 18x18 Multipliers | 312 | — |
| Maximum User I/O | 377 | — |
| PLLs | 4 | 4 |
| Global Clocks | 20 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Gehäuse | 780-ball FBGA (F780) | 780-ball FineLine BGA |
| Package Code | BGA, 780 balls | — |
| Speed Grade | C6 | 7 |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial, C7 speed grade) |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | — |
| Voltage - Supply (Core) | 1.2 V (typical) | — |
| Voltage - I/O | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) | — |
| Logic Elements | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits (approximately 2.4 Mbit) |
| Embedded Memory Blocks | — | 312 M9K blocks |
| Embedded Multipliers | — | 156 (18 x 18) |
| User I/O Count | — | 377 |
| Global Clock Networks | — | 20 |
| Configuration Memory | — | 8 Kbits (supports PS, FPP, JTAG) |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Bank Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |