EP3C55F780C6N vs EP3C55F780C8N Vergleich
Detaillierter Direktvergleich von EP3C55F780C6N von Intel und EP3C55F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C6N | EP3C55F780C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,10 | $58,20 |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III FPGA | Cyclone III (low-cost FPGA) |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Memory (Kb) | 2,340 Kb | — |
| Embedded 18x18 Multipliers | 312 | 156 |
| Maximum User I/O | 377 | 377 |
| PLLs | 4 | 4 |
| Global Clocks | 20 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-power |
| Gehäuse | 780-ball FBGA (F780) | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Package Code | BGA, 780 balls | — |
| Speed Grade | C6 | 8 (commercial, slowest) |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial, 'C' suffix) |
| RoHS-Status | Compliant | Compliant (lead-free FBGA) |
| Montageart | Surface Mount | — |
| Voltage - Supply (Core) | 1.2 V (typical) | — |
| Voltage - I/O | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) | — |
| Logic Array Blocks (LAB) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | — | 260 |
| User I/O Banks | — | 4 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Configuration Modes | — | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Internal Frequency (typ.) | — | 402 MHz |