EP3C55F780C7N vs EP3C40F780C7N Vergleich
Detaillierter Direktvergleich von EP3C55F780C7N von Intel und EP3C40F780C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C7N | EP3C40F780C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,31 | $145,40 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | 39,600 LE |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | — |
| Embedded Memory Blocks | 312 M9K blocks | — |
| Embedded Multipliers | 156 (18 x 18) | 126 (18x18) |
| User I/O Count | 377 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | — |
| Process Technology | 65 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Betriebstemperatur | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (commercial) |
| Gehäuse | 780-ball FineLine BGA | 780-ball FBGA (FineLine BGA) |
| Speed Grade | 7 | 7 (C7, commercial) |
| RoHS-Status | Compliant | — |
| Total RAM Bits | — | 1,161,216 bits |
| User I/Os | — | 535 |
| Process Node | — | 65 nm TSMC low-power |
| Supply Voltage (Core) | — | 1.2 V |
| Configuration Method | — | JTAG, Active Serial, Passive Serial |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Moisture Sensitivity Level | — | MSL3 (per J-STD-020) |