EP3C55F780C7N vs EP3C55F780C7 Vergleich
Detaillierter Direktvergleich von EP3C55F780C7N von Intel und EP3C55F780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C7N | EP3C55F780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,31 | $76,75 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | — |
| Embedded Memory Blocks | 312 M9K blocks | — |
| Embedded Multipliers | 156 (18 x 18) | — |
| User I/O Count | 377 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | — |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Betriebstemperatur | 0C to +85C (commercial, C7 speed grade) | — |
| Gehäuse | 780-ball FineLine BGA | 780-ball FBGA (F780) |
| Speed Grade | 7 | 7 |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory Bits | — | 2,396,160 bits (~234 Kbyte M9K) |
| Embedded 18x18 Multipliers | — | 234 |
| Maximum User I/O Pins | — | 377 |
| Maximum Internal Clock Frequency | — | 437.5 MHz |
| Operating Temperature Grade | — | Commercial (C) |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Montageart | — | Surface Mount (BGA) |