EP3C55F780C7N vs EP3C55F780I7N Vergleich
Detaillierter Direktvergleich von EP3C55F780C7N von Intel und EP3C55F780I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C7N | EP3C55F780I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,31 | $195,00 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | 55,856 |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | — |
| Embedded Memory Blocks | 312 M9K blocks | — |
| Embedded Multipliers | 156 (18 x 18) | — |
| User I/O Count | 377 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | — |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Betriebstemperatur | 0C to +85C (commercial, C7 speed grade) | — |
| Gehäuse | 780-ball FineLine BGA | 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height) |
| Speed Grade | 7 | -7 (fastest) |
| RoHS-Status | Compliant | — |
| Total RAM Bits | — | 2,396,160 |
| Number of Logic Array Blocks (LABs) | — | 2,426 |
| Embedded 18x18 Multipliers | — | 56 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Maximum User I/O Count | — | 377 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Maximum Internal Frequency | — | 472 MHz |
| Montageart | — | Surface Mount |
| Lead-Free / RoHS | — | Lead free, RoHS compliant |
| Configuration Scheme | — | Passive Serial / JTAG / Active Serial |