EP3C55F780C7N vs EP3C55F780I8N Vergleich
Detaillierter Direktvergleich von EP3C55F780C7N von Intel und EP3C55F780I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C7N | EP3C55F780I8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,31 | $52,90 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | — |
| Embedded Memory Blocks | 312 M9K blocks | — |
| Embedded Multipliers | 156 (18 x 18) | — |
| User I/O Count | 377 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | — |
| Process Technology | 65 nm low-power CMOS | Low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Betriebstemperatur | 0C to +85C (commercial, C7 speed grade) | — |
| Gehäuse | 780-ball FineLine BGA | 780-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Speed Grade | 7 | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,491 |
| Embedded Memory (M9K blocks) | — | 234 Kbits total |
| Embedded 18x18 Multipliers | — | 156 |
| Maximum User I/Os | — | 377 |
| Core Supply Voltage | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Montageart | — | Surface Mount |
| Operating Temperature (Industrial) | — | -40C to +100C |
| Configuration Method | — | JTAG / Active Serial / Passive Serial / Fast Passive Parallel |