EP3C55F780I7N vs EP3C55F780C8N Vergleich

Detaillierter Direktvergleich von EP3C55F780I7N von Intel und EP3C55F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C55F780I7N EP3C55F780C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $195,00 $58,20
Family Cyclone III Cyclone III (low-cost FPGA)
Logic Elements 55,856 —
Total RAM Bits 2,396,160 2,396,160 bits (2396 Kbit)
Number of Logic Array Blocks (LABs) 2,426 —
Embedded 18x18 Multipliers 56 156
Phase-Locked Loops (PLLs) 4 —
Maximum User I/O Count 377 —
Core Voltage 1.2 V —
Operating Temperature (Industrial) -40 °C to +100 °C —
Maximum Internal Frequency 472 MHz —
Process Technology 65 nm 65 nm TSMC low-power
Gehäuse 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height) 780-pin FBGA (29x29 mm, 1.0 mm pitch)
Montageart Surface Mount —
Lead-Free / RoHS Lead free, RoHS compliant —
Configuration Scheme Passive Serial / JTAG / Active Serial —
Speed Grade -7 (fastest) 8 (commercial, slowest)
Series — Cyclone III
Logic Elements (LE) — 55,856
Logic Array Blocks (LAB) — 3,491
Embedded Memory Blocks (M9K) — 260
PLLs — 4
Maximum User I/O — 377
User I/O Banks — 4
Core Supply Voltage — 1.15 V to 1.25 V
Betriebstemperatur — 0C to +85C (commercial, 'C' suffix)
Configuration Modes — Active Serial, Passive Serial, Fast Passive Parallel, JTAG
Internal Frequency (typ.) — 402 MHz
RoHS-Status — Compliant (lead-free FBGA)

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