EP3C55U484C7N vs EP3C55U484C8N Vergleich
Detaillierter Direktvergleich von EP3C55U484C7N von Intel und EP3C55U484C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55U484C7N | EP3C55U484C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $140,25 | $119,85 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 (2.4 Mbit) | — |
| Maximum User I/Os | 327 | 327 |
| I/O Banks | 8 | — |
| DSP Blocks (18 x 18 Multipliers) | 156 (260 multipliers reported by some sources - [DATA_NEEDED: confirm multiplier count from device handbook]) | — |
| PLLs | 4 | — |
| M9K Memory Blocks | 260 | — |
| Process Technology | 65 nm low-power CMOS | 60 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | 0 C to +85 C (commercial) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Gehäuse | 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm | 484-UBGA (Ultra FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| RoHS-Status | Compliant | — |
| Family | — | EP3C55 |
| Embedded Memory (bits) | — | 2,396,160 |
| Number of Logic Array Blocks (LABs) | — | 3,491 |
| Number of M9K Memory Blocks | — | 250 |
| Embedded 18x18 Multipliers | — | 156 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Number of I/O Banks | — | 8 |
| Speed Grade | — | 8 (commercial, fastest) |
| Lead-Free / RoHS | — | Compliant (per DigiKey listing) |