EP3C55U484C8N vs EP3C55U484C7 Vergleich
Detaillierter Direktvergleich von EP3C55U484C8N von Intel und EP3C55U484C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55U484C8N | EP3C55U484C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $119,85 | $23,10 |
| Series | Cyclone III | Cyclone III |
| Family | EP3C55 | — |
| Logic Elements | 55,856 | — |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of M9K Memory Blocks | 250 | — |
| Embedded 18x18 Multipliers | 156 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Maximum User I/Os | 327 | — |
| Number of I/O Banks | 8 | — |
| Gehäuse | 484-UBGA (Ultra FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 484-ball UBGA (Ultra-FineLine BGA) |
| Speed Grade | 8 (commercial, fastest) | C7 (Commercial) |
| Process Technology | 60 nm low-power CMOS | 65 nm CMOS |
| Betriebstemperatur | 0 C to +85 C (commercial) | 0C to +85C (Commercial) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Compliant (per DigiKey listing) | — |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,488 |
| Embedded Multipliers (18x18) | — | 156 |
| Maximum User I/O Pins | — | 327 |
| Number of PLLs | — | 4 |
| Maximum Operating Frequency | — | 437 MHz |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.2 V / 2.5 V / 3.0 V / 3.3 V |
| Package Dimensions | — | 19 x 19 mm |
| Ball Pitch | — | 0.80 mm |
| RoHS-Status | — | Compliant |