EP3C5F256C6 vs EP3C5F256I7N Vergleich
Detaillierter Direktvergleich von EP3C5F256C6 von Intel und EP3C5F256I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256C6 | EP3C5F256I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $21,40 | $24,00 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | — |
| Total Memory Bits | 423,936 bits | 423,936 bits |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | — |
| User I/Os | 182 | — |
| PLLs | 4 | 2 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 65 nm CMOS, low-k | TSMC 65nm low-power |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Gehäuse | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-FBGA (FineLine BGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | Active Serial, Passive Serial, JTAG, FPP |
| RoHS-Status | Compliant (lead-free per FBGA package) | Compliant |
| Logic Elements | — | 5,136 |
| Embedded Multipliers (18x18) | — | 26 |
| Maximum User I/Os | — | 182 |
| Betriebstemperatur | — | -40C to +125C (Industrial) |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (typical 1.2 V) |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| MSL-Level | — | 3 (168 hours) |