EP3C5F256C8N vs EP3C5F256I7 Vergleich
Detaillierter Direktvergleich von EP3C5F256C8N von Intel und EP3C5F256I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256C8N | EP3C5F256I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,95 | $22,36 |
| Series | Cyclone III | — |
| Device Family | Cyclone III (EP3C5) | — |
| Logic Elements (LEs) | 5,136 | — |
| Embedded Memory (bits) | 423,936 | — |
| Embedded Memory (Kbits) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | — |
| PLLs | 4 | — |
| Maximum User I/Os | 182 | — |
| Core Voltage | 1.15 V to 1.25 V | — |
| Betriebstemperatur | 0C to 85C (Commercial) | — |
| Gehäuse | 256-ball FBGA (FineLine BGA) | — |
| Process Technology | 65 nm | — |
| Configuration Memory | SRAM-based (in-system reprogrammable) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| RoHS-Status | Lead Free (per Altera/Intel product page) | — |
| Montageart | Surface Mount | Surface Mount |
| FPGA Family | — | Cyclone III |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 5136 |
| Total RAM Bits | — | 423936 bits |
| Maximum User I/O Count | — | 182 |
| Gehäuse / Bauform | — | 256-LBGA (FBGA-256) |
| Package Shape | — | Square |
| Number of Terminals | — | 256 |
| Terminal Form | — | Ball |
| Technology | — | CMOS |
| Maximum Operating Frequency | — | 472.5 MHz |
| Betriebstemperaturbereich | — | -40C to 125C |
| Speed Grade | — | 7 (per -7 order code) |
| Temperature Grade | — | I (industrial, per -I7 order code) |
| Lead-Free Finish | — | Yes (per distributor listing) |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage] |