EP3C80F780C7 vs EP3C40F780C7N Vergleich
Detaillierter Direktvergleich von EP3C80F780C7 von Intel und EP3C40F780C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C80F780C7 | EP3C40F780C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $298,75 | $145,40 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 81,264 | — |
| Embedded Memory Bits | 2,810,880 | — |
| Embedded Memory Blocks | M9K (9 Kbit each) | — |
| Embedded 18x18 Multipliers | 244 | — |
| User I/O Pins | 429 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 20 | 20 |
| Process Technology | 65 nm CMOS, low-power | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Configuration Scheme | SRAM, external flash (EPCS) | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Speed Grade | C7 | 7 (C7, commercial) |
| RoHS-Status | Compliant | — |
| Logic Elements | — | 39,600 LE |
| Total RAM Bits | — | 1,161,216 bits |
| Embedded Multipliers | — | 126 (18x18) |
| User I/Os | — | 535 |
| Process Node | — | 65 nm TSMC low-power |
| Supply Voltage (Core) | — | 1.2 V |
| Configuration Method | — | JTAG, Active Serial, Passive Serial |
| PLLs | — | 4 |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Moisture Sensitivity Level | — | MSL3 (per J-STD-020) |