EP3CLS100F484C7N vs EP3C55F484C7N Vergleich
Detaillierter Direktvergleich von EP3CLS100F484C7N von Intel und EP3C55F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS100F484C7N | EP3C55F484C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $495,80 | $52,75 |
| Family | Cyclone III LS | Cyclone III |
| Logic Elements | 100,448 | 55,856 |
| Embedded Memory (bits) | 4,451,328 | 2,396,160 |
| User I/O Pins | 278 | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| PLLs | 4 | 4 |
| Global Clock Networks | [DATA_NEEDED: global clock count] | 20 |
| Process Technology | 65 nm low-power (TSMC) | 60 nm TSMC low-power |
| Core Supply Voltage | 1.2 V | — |
| Operating Temperature (junction) | 0°C to +85°C (commercial) | — |
| Speed Grade | C7 | 7 |
| Gehäuse | 484-ball FineLine BGA (FBGA-484) | 484-FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | [DATA_NEEDED: package body dimensions] | — |
| Configuration Method | SRAM-based (volatile), via EPCS/JTAG/parallel flash | — |
| Security Features | Bitstream encryption, JTAG tamper protection | — |
| Montageart | Surface Mount | — |
| RoHS-Status | Compliant (lead-free, N suffix) | Compliant |
| Design Software | Quartus II / Intel Quartus Prime | — |
| Maximum User I/O | — | 327 |
| Number of LABs/CLBs | — | 3,491 |
| Embedded Multipliers (18x18) | — | 156 |
| Betriebstemperatur | — | 0C to 85C (Commercial) |
| Configuration Modes | — | JTAG, AS, AP, PS |
| Encryption | — | AES-256 |
| Versorgungsspannung | — | 1.2 V core (VCCINT) |