EP3CLS100F484C8N vs EP3CLS100F484C7 Vergleich

Detaillierter Direktvergleich von EP3CLS100F484C8N von Intel und EP3CLS100F484C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS100F484C8N EP3CLS100F484C7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $115,40 $62,80
Series Cyclone® III LS —
Family Name Cyclone III LS —
Logic Elements 100,448 —
Embedded Memory Bits 4,451,328 bits 4,451,328
Number of I/O 278 (maximum user I/O) —
Number of Logic Blocks / Cells 47 (logic blocks reported by DigChip snapshot) —
Package Type FBGA-484 (FineLine BGA, lead-free) —
Pin / Ball Count 484 —
Supply Voltage (Core) 1.2 V —
Speed Grade C8 (commercial, fastest) —
Process Technology TSMC 65 nm low-power (LP) 65 nm
Betriebstemperatur 0°C to +85°C (commercial grade) —
Montageart Surface Mount Surface Mount
Configuration Interface JTAG, Passive Serial, Active Serial —
Bitstream Encryption AES-128 (Cyclone III LS security feature) —
RoHS-Status Compliant (Pb-free, 'N' suffix) Compliant
MSL-Level 3 (per JEDEC J-STD-020, typical for BGA) —
Embedded Multipliers (18x18) 4,488 (per Cyclone III LS family handbook, 100K LE tier) —
PLLs 4 (per Cyclone III LS family) 4
DSP Blocks Integrated (multiplier-based) —
Family — Cyclone III LS
Logic Elements (LE) — 100,448
Maximum User I/Os — 278
Logic Blocks / Logic Cells — 47
Core Voltage — 1.2 V
Maximum Internal Frequency — 437.5 MHz
Gehäuse — 484-ball FBGA (Fine-Pitch BGA)
Operating Temperature Grade — Commercial
Configuration Memory — SRAM-based (volatile, requires external config device)
Design Software — Quartus II / Quartus Prime

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