EP3CLS100F484I7N vs EP3CLS100F484C7N Vergleich

Detaillierter Direktvergleich von EP3CLS100F484I7N von Intel und EP3CLS100F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS100F484I7N EP3CLS100F484C7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $67,90 $495,80
Family Cyclone III LS Cyclone III LS
Device Type FPGA - Field Programmable Gate Array —
Logic Elements (LE) 100,448 —
Logic Array Blocks (LAB) 6,278 —
Embedded Memory 4,451,328 bits (M9K blocks) —
18x18 Multipliers 278 —
User I/O Pins (max) 294 —
PLLs 4 4
Process Technology 65 nm CMOS 65 nm low-power (TSMC)
Core Supply Voltage (VCCINT) 1.2 V —
Maximum Internal Frequency 437.5 MHz —
Gehäuse 484-ball FBGA (F484) 484-ball FineLine BGA (FBGA-484)
Operating Temperature (Industrial) -40 °C to +100 °C —
Speed Grade 7 (medium) C7
Configuration Modes AS, PS, JTAG, FPP —
Lead-Free / RoHS Yes (LEAD FREE per FindIC) —
Logic Elements — 100,448
Embedded Memory (bits) — 4,451,328
User I/O Pins — 278
DSP Blocks (18x18 multipliers) — [DATA_NEEDED: DSP block count]
Global Clock Networks — [DATA_NEEDED: global clock count]
Core Supply Voltage — 1.2 V
Operating Temperature (junction) — 0°C to +85°C (commercial)
Ball Pitch — 1.0 mm
Package Dimensions — [DATA_NEEDED: package body dimensions]
Configuration Method — SRAM-based (volatile), via EPCS/JTAG/parallel flash
Security Features — Bitstream encryption, JTAG tamper protection
Montageart — Surface Mount
RoHS-Status — Compliant (lead-free, N suffix)
Design Software — Quartus II / Intel Quartus Prime

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