EP3CLS100F780C7 vs EP3C120F780C8N Vergleich

Detaillierter Direktvergleich von EP3CLS100F780C7 von Intel und EP3C120F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS100F780C7 EP3C120F780C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $632,40 $0,00
Family Cyclone III LS Cyclone III
Logic Elements (LEs) 100,448 —
Total RAM Bits 4,451,328 —
Embedded Memory M9K blocks (488 total, 4,451,328 bits) 3981312 bit
Embedded 18x18 Multipliers 66 —
Maximum User I/O Pins 413 —
Logic Array Blocks (LABs) [DATA_NEEDED: exact LAB count for EP3CLS100] —
Gehäuse 780-ball FineLine BGA (FBGA-780) —
Package Dimensions 29 mm x 29 mm 23 mm x 23 mm
Ball Pitch 1.0 mm 1 mm
Core Supply Voltage (VCCINT) 1.2 V —
I/O Supply Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) —
Process Technology 60 nm low-power CMOS —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG —
Bitstream Encryption AES-128 (Cyclone III LS security feature) —
Betriebs-Sperrschichttemperatur 0C to +85C (commercial, 'C' grade) —
RoHS-Status Compliant (lead-free FBGA) —
Speed Grade 7 (C7) —
Device Type — Field Programmable Gate Array (FPGA)
Logic Elements — 119088
User I/O Count — 531
Betriebsversorgungsspannung — 1.2 V
Maximum Internal Frequency — 402 MHz
Alternate Listed Internal Frequency — 472 MHz
Package Type — FBGA-780
Package Height — 2.60 mm
Montageart — Surface Mount
Ordering Status — Buy now, ships today
Compliance — [DATA_NEEDED: compliance and environmental certifications]
Betriebstemperatur — [DATA_NEEDED: operating temperature range]
Configuration Memory Type — [DATA_NEEDED: configuration memory technology]

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern