EP3CLS100F780C7 vs EP3CLS100F780I7 Vergleich

Detaillierter Direktvergleich von EP3CLS100F780C7 von Intel und EP3CLS100F780I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS100F780C7 EP3CLS100F780I7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $632,40 $775,00
Family Cyclone III LS —
Logic Elements (LEs) 100,448 —
Total RAM Bits 4,451,328 —
Embedded Memory M9K blocks (488 total, 4,451,328 bits) —
Embedded 18x18 Multipliers 66 —
Maximum User I/O Pins 413 —
Logic Array Blocks (LABs) [DATA_NEEDED: exact LAB count for EP3CLS100] —
Gehäuse 780-ball FineLine BGA (FBGA-780) 780-ball FBGA (F780)
Package Dimensions 29 mm x 29 mm —
Ball Pitch 1.0 mm —
Core Supply Voltage (VCCINT) 1.2 V —
I/O Supply Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) —
Process Technology 60 nm low-power CMOS 60 nm low-power CMOS
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG —
Bitstream Encryption AES-128 (Cyclone III LS security feature) —
Betriebs-Sperrschichttemperatur 0C to +85C (commercial, 'C' grade) —
RoHS-Status Compliant (lead-free FBGA) Compliant
Speed Grade 7 (C7) —
Device Family — Cyclone III LS
Device Type — FPGA (Field Programmable Gate Array)
Logic Elements — 100,448
Embedded Memory Bits — 4,451,328 bits (~4.4 Mbit)
Number of Logic Array Blocks — 47 (per distributor summary)
Number of Transceivers — 4
Maximum User I/O — 413
Supply Voltage (Core) — 1.2 V
Operating Temperature Grade — Industrial (-40C to +100C)
Configuration Method — SRAM-based, JTAG or external flash (EPCS/EPCQ)
I/O Standards Supported — LVDS, LVCMOS, LVTTL, SSTL, HSTL
PLLs — Up to 8 (family maximum)
Security Features — 256-bit AES bitstream encryption, JTAG disable
Montageart — Surface Mount (BGA)

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