EP3CLS100F780C7 vs EP3CLS70F780C7 Vergleich

Detaillierter Direktvergleich von EP3CLS100F780C7 von Intel und EP3CLS70F780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS100F780C7 EP3CLS70F780C7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $632,40 $350,00
Family Cyclone III LS Cyclone III LS
Logic Elements (LEs) 100,448 —
Total RAM Bits 4,451,328 —
Embedded Memory M9K blocks (488 total, 4,451,328 bits) —
Embedded 18x18 Multipliers 66 —
Maximum User I/O Pins 413 —
Logic Array Blocks (LABs) [DATA_NEEDED: exact LAB count for EP3CLS100] —
Gehäuse 780-ball FineLine BGA (FBGA-780) 780-ball FBGA
Package Dimensions 29 mm x 29 mm —
Ball Pitch 1.0 mm —
Core Supply Voltage (VCCINT) 1.2 V 1.2 V
I/O Supply Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) —
Process Technology 60 nm low-power CMOS 65 nm
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG —
Bitstream Encryption AES-128 (Cyclone III LS security feature) —
Betriebs-Sperrschichttemperatur 0C to +85C (commercial, 'C' grade) —
RoHS-Status Compliant (lead-free FBGA) Compliant
Speed Grade 7 (C7) C7 (commercial, low power)
Logic Elements — 70,208
Embedded Memory Bits — 3,068,928
User I/O Pins — 413
Total I/O Pins — 780 (FBGA package)
Operating Frequency (max) — 437.5 MHz
Montageart — Surface Mount
Security Features — AES-256 bitstream encryption, JTAG protection, volatile key storage
Embedded Multipliers — 18 x 18 multipliers (DSP blocks)
PLLs — Yes (per PLL specification)

Datenblätter & Ressourcen

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