EP3CLS100F780C8 vs EP3CLS150F780C8 Vergleich

Detaillierter Direktvergleich von EP3CLS100F780C8 von Intel und EP3CLS150F780C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS100F780C8 EP3CLS150F780C8
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $65,00 $195,20
Family Cyclone III LS Cyclone III LS
Logic Elements (LE) 100,448 —
Logic Array Blocks (LAB) [DATA_NEEDED: LAB count] —
Total Embedded Memory 4,451,328 bits —
Embedded Memory Blocks (M9K) 483 —
Embedded 18x18 Multipliers 483 —
Maximum User I/O 413 —
PLLs 4 —
Global Clock Networks 20 —
Core Voltage 1.2 V —
Process Technology 60 nm low-power TSMC 65 nm
Gehäuse 780-ball FBGA (F780) —
Device Type FPGA - Field Programmable Gate Array —
Bitstream Encryption AES-256 (Cyclone III LS feature) —
Operating Temperature Grade Commercial (C8 speed grade) —
Speed Grade 8 (slowest commercial) —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status Compliant —
Configuration Controller Cyclone III LS (AES-enabled) —
Series — Cyclone III
Logic Elements / Cells — 150,848
Total Memory Bits — 6,137,856
Number of LABs — 9,428
Number of Logic Array Blocks — 9,428
User I/O Pins — 413
Number of PLLs — 4
Core Supply Voltage — 1.2 V
Maximum Operating Frequency — 402 MHz
Betriebstemperatur — 0 C to 85 C (Commercial)
Package Type — FBGA-780
Package Dimensions — 29 x 29 mm
Ball Pitch — 1.0 mm
Lead Free / RoHS — Compliant
Configuration Mode — JTAG, Passive Serial, Active Serial, Fast Passive Parallel

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