EP3CLS100F780C8N vs EP3CLS100F780I7 Vergleich

Detaillierter Direktvergleich von EP3CLS100F780C8N von Intel und EP3CLS100F780I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS100F780C8N EP3CLS100F780I7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $105,80 $775,00
Device Family Cyclone III LS Cyclone III LS
Logic Elements (LE) 100,448 —
Total Memory Bits 4,451,328 —
Embedded Memory Blocks M9K + M144K —
Logic Array Blocks (LAB) 6,278 —
Number of PLLs 4 —
Maximum User I/O 429 413
Core Supply Voltage (VCCINT) 1.2 V —
Analog Supply (VCCA) 2.5 V —
Process Technology 65 nm low-power CMOS 60 nm low-power CMOS
Maximum Embedded Multipliers (18x18) 244 —
Gehäuse 780-ball FBGA (FineLine BGA) 780-ball FBGA (F780)
Package Dimensions 29 mm x 29 mm, 1.0 mm ball pitch —
Operating Temperature (Commercial) 0C to +85C —
Montageart Surface Mount (BGA) Surface Mount (BGA)
Configuration Schemes AS, PS, PP, JTAG —
RoHS-Status Compliant Compliant
Lead-Free Yes —
Device Type — FPGA (Field Programmable Gate Array)
Logic Elements — 100,448
Embedded Memory Bits — 4,451,328 bits (~4.4 Mbit)
Number of Logic Array Blocks — 47 (per distributor summary)
Number of Transceivers — 4
Supply Voltage (Core) — 1.2 V
Operating Temperature Grade — Industrial (-40C to +100C)
Configuration Method — SRAM-based, JTAG or external flash (EPCS/EPCQ)
I/O Standards Supported — LVDS, LVCMOS, LVTTL, SSTL, HSTL
PLLs — Up to 8 (family maximum)
Security Features — 256-bit AES bitstream encryption, JTAG disable

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