EP3CLS100F780C8N vs EP3CLS150F780C7N Vergleich
Detaillierter Direktvergleich von EP3CLS100F780C8N von Intel und EP3CLS150F780C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS100F780C8N | EP3CLS150F780C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $105,80 | $88,40 |
| Device Family | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 100,448 | — |
| Total Memory Bits | 4,451,328 | — |
| Embedded Memory Blocks | M9K + M144K | — |
| Logic Array Blocks (LAB) | 6,278 | — |
| Number of PLLs | 4 | — |
| Maximum User I/O | 429 | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Analog Supply (VCCA) | 2.5 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS |
| Maximum Embedded Multipliers (18x18) | 244 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (29x29 mm, 1.0 mm pitch) |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm ball pitch | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Montageart | Surface Mount (BGA) | — |
| Configuration Schemes | AS, PS, PP, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 150,848 |
| Logic Array Blocks (LABs) | — | 9,428 |
| Embedded Memory (M9K blocks) | — | 5,994 Kbits |
| Embedded Multipliers (18x18) | — | 320 |
| Maximum User I/O Pins | — | 413 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Core Supply Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 437.5 MHz |
| External Memory Interfaces | — | DDR2 SDRAM, QDRII+ SRAM |
| Speed Grade | — | C7 (commercial, -7 speed grade) |
| Configuration Methods | — | JTAG, Active Serial (AS), Passive Serial (PS) |
| Betriebstemperatur | — | 0C to +85C (commercial) |