EP3CLS150F780C7N vs EP3CLS150F780C8 Vergleich
Detaillierter Direktvergleich von EP3CLS150F780C7N von Intel und EP3CLS150F780C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS150F780C7N | EP3CLS150F780C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $88,40 | $195,20 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LEs) | 150,848 | — |
| Logic Array Blocks (LABs) | 9,428 | — |
| Embedded Memory (M9K blocks) | 5,994 Kbits | — |
| Embedded Multipliers (18x18) | 320 | — |
| Maximum User I/O Pins | 413 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Maximum Operating Frequency | 437.5 MHz | 402 MHz |
| External Memory Interfaces | DDR2 SDRAM, QDRII+ SRAM | — |
| Gehäuse | 780-ball FBGA (29x29 mm, 1.0 mm pitch) | — |
| Speed Grade | C7 (commercial, -7 speed grade) | — |
| Configuration Methods | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0 C to 85 C (Commercial) |
| RoHS-Status | Compliant | — |
| Family | — | Cyclone III LS |
| Series | — | Cyclone III |
| Logic Elements / Cells | — | 150,848 |
| Total Memory Bits | — | 6,137,856 |
| Number of LABs | — | 9,428 |
| Number of Logic Array Blocks | — | 9,428 |
| User I/O Pins | — | 413 |
| Number of PLLs | — | 4 |
| Package Type | — | FBGA-780 |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Montageart | — | Surface Mount |
| Lead Free / RoHS | — | Compliant |
| Configuration Mode | — | JTAG, Passive Serial, Active Serial, Fast Passive Parallel |