EP3CLS150F780C8 vs EP3CLS70F780C8 Vergleich
Detaillierter Direktvergleich von EP3CLS150F780C8 von Intel und EP3CLS70F780C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS150F780C8 | EP3CLS70F780C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,20 | $56,75 |
| Family | Cyclone III LS | Cyclone III LS |
| Series | Cyclone III | — |
| Logic Elements / Cells | 150,848 | — |
| Total Memory Bits | 6,137,856 | — |
| Number of LABs | 9,428 | — |
| Number of Logic Array Blocks | 9,428 | — |
| User I/O Pins | 413 | — |
| Number of PLLs | 4 | — |
| Process Technology | 65 nm | 65 nm TSMC low-power CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Maximum Operating Frequency | 402 MHz | 402 MHz |
| Betriebstemperatur | 0 C to 85 C (Commercial) | — |
| Package Type | FBGA-780 | — |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead Free / RoHS | Compliant | — |
| Configuration Mode | JTAG, Passive Serial, Active Serial, Fast Passive Parallel | — |
| Logic Elements (LE) | — | 70,208 |
| Logic Array Blocks (LAB) | — | 4,463 |
| Embedded Memory Bits | — | 3,068,928 bit |
| Embedded Memory (M9K blocks) | — | 305 |
| Embedded 18x18 Multipliers | — | 244 |
| Maximum User I/O Pins | — | 413 |
| Gehäuse | — | 780-ball FineLine BGA (FBGA-780) |
| Betriebs-Sperrschichttemperatur | — | 0 °C to +85 °C (commercial) |
| PLLs | — | 4 general-purpose PLLs |
| Global Clock Networks | — | 20 |
| Security Features | — | AES bitstream encryption, JTAG tamper protection |
| Configuration Scheme | — | Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP) |
| RoHS-Status | — | Compliant |