EP3CLS200F484C7 vs EP3CLS200F484C8N Vergleich
Detaillierter Direktvergleich von EP3CLS200F484C7 von Intel und EP3CLS200F484C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484C7 | EP3CLS200F484C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.720,00 | $1.245,00 |
| Family | Cyclone III LS | Cyclone® III LS |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LABs) | 12,408 | [DATA_NEEDED: exact LAB count] |
| Embedded Memory (RAM bits) | 8,211,456 | — |
| Maximum User I/Os | 226 | — |
| DSP Blocks | 396 (18x18 multipliers) | — |
| PLLs | 4 | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Gehäuse | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Process Technology | CMOS, low-power | 65 nm CMOS, low-leakage |
| Betriebstemperatur | 0C to +85C (commercial, C7 speed grade) | — |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | Cyclone III LS |
| Logic Elements | — | 198,464 |
| Embedded Memory | — | 8,211,456 bits (8.21 Mbit) |
| Embedded Multipliers (18x18) | — | 396 |
| User I/O Pins | — | 210 |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 402 MHz (fabric) |
| Speed Grade | — | 8 (slowest) |
| Temperature Grade | — | Commercial (0C to +85C TJ) |
| Bitstream Encryption | — | AES-128 (256-bit key via separate license) |
| Configuration Mode | — | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |