EP3CLS200F484C7 vs EP3CLS200F484I7 Vergleich
Detaillierter Direktvergleich von EP3CLS200F484C7 von Intel und EP3CLS200F484I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484C7 | EP3CLS200F484I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.720,00 | $3.580,00 |
| Family | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | 198464 |
| Logic Array Blocks (LABs) | 12,408 | — |
| Embedded Memory (RAM bits) | 8,211,456 | — |
| Maximum User I/Os | 226 | — |
| DSP Blocks | 396 (18x18 multipliers) | — |
| PLLs | 4 | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Gehäuse | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) |
| Process Technology | CMOS, low-power | 60 nm low-power CMOS |
| Betriebstemperatur | 0C to +85C (commercial, C7 speed grade) | -40 °C to +85 °C (Industrial) |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| RoHS-Status | Compliant | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Family | — | Cyclone III LS |
| CLBs | — | 198464 |
| Total Memory Bits | — | 8211456 bits (~1.0 MB) |
| Embedded Memory Blocks | — | 432 M9K blocks |
| User I/O Pins | — | 210 |
| Maximum Operating Frequency | — | 450 MHz |
| Number of PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Versorgungsspannung | — | 1.2 V |
| Bitstream Encryption | — | AES (Cyclone III LS feature) |