EP3CLS200F484C7N vs EP3CLS200F484I8N Vergleich
Detaillierter Direktvergleich von EP3CLS200F484C7N von Intel und EP3CLS200F484I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484C7N | EP3CLS200F484I8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.650,00 | $125,00 |
| Series | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LAB) | 12,404 | — |
| Embedded Memory | 8,211,456 bits | — |
| Embedded 18x18 Multipliers | 210 | — |
| User I/O | 226 | — |
| Gehäuse | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-ball FBGA (FineLine BGA) |
| Core Voltage | 1.2 V | — |
| Betriebstemperatur | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount |
| Family | — | Cyclone III LS |
| Device Type | — | FPGA |
| Logic Elements | — | 198,464 |
| Embedded Memory Bits | — | 8,211,456 |
| Maximum User I/O Pins | — | 230 (typical, package-dependent) |
| Core Supply Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 402 MHz |
| Speed Grade | — | 8 |
| Number of PLLs | — | 4 |
| Number of Global Clock Networks | — | 20 |