EP3CLS200F484C8 vs EP3CLS70F484C8 Vergleich
Detaillierter Direktvergleich von EP3CLS200F484C8 von Intel und EP3CLS70F484C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484C8 | EP3CLS70F484C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $118,00 | $198,00 |
| Series | Cyclone III LS | — |
| Family | Cyclone III LS (low-power Cyclone III) | Cyclone III LS |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LAB) | 20,5056 (approx) | — |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) | — |
| Embedded 18x18 Multipliers | 210 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 304 | — |
| I/O Banks | 8 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-power |
| Gehäuse | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA (FBGA-484) |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Security | Design encryption / bitstream AES | — |
| Betriebstemperatur | 0C to +85C (commercial, 'C' suffix) | — |
| Montageart | Surface Mount | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 70,208 |
| Logic Array Blocks (LABs) | — | 278 |
| Total Embedded Memory Bits | — | 3,068,928 |
| Embedded Memory Blocks | — | M9K (4 Kbit each) |
| Embedded Multipliers (18x18) | — | 300 |
| Maximum User I/O Pins | — | 278 |
| Global Clock Networks | — | 20 |
| Core Supply Voltage | — | 1.2 V |
| Betriebs-Sperrschichttemperatur | — | 0C to +85C (commercial) |
| Bitstream Encryption | — | AES-256 (Cyclone III LS feature) |
| Configuration Mode | — | Active serial, passive serial, JTAG, fast passive parallel |
| Lead-Free | — | Yes |