EP3CLS200F484I7N vs EP3CLS200F484C7N Vergleich
Detaillierter Direktvergleich von EP3CLS200F484I7N von Intel und EP3CLS200F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484I7N | EP3CLS200F484C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $198,00 | $1.650,00 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LEs) | 198,464 | — |
| Embedded Memory Bits | 8,211,456 | — |
| Maximum User I/O | 210 | — |
| Maximum Operating Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Package Type | FBGA-484 | — |
| Pin/Ball Count | 484 | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Speed Grade | 7 | — |
| RoHS-Status | Compliant | Compliant |
| Configuration Scheme | FPGA (SRAM-based, external configuration) | — |
| Hardware Crypto Accelerator | Yes (AES, SHA - LS family feature) | — |
| Series | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 12,404 |
| Embedded Memory | — | 8,211,456 bits |
| Embedded 18x18 Multipliers | — | 210 |
| User I/O | — | 226 |
| Gehäuse | — | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Core Voltage | — | 1.2 V |
| Configuration Modes | — | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |
| PLLs | — | 4 |