EP3CLS200F484I7N vs EP3CLS200F484C8N Vergleich

Detaillierter Direktvergleich von EP3CLS200F484I7N von Intel und EP3CLS200F484C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS200F484I7N EP3CLS200F484C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $198,00 $1.245,00
Device Family Cyclone III LS —
Logic Elements (LEs) 198,464 —
Embedded Memory Bits 8,211,456 —
Maximum User I/O 210 —
Maximum Operating Frequency 437.5 MHz 402 MHz (fabric)
Process Technology 65 nm 65 nm CMOS, low-leakage
Core Supply Voltage 1.2 V —
Package Type FBGA-484 —
Pin/Ball Count 484 —
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperatur -40C to +100C (Industrial) —
Speed Grade 7 8 (slowest)
RoHS-Status Compliant Compliant
Configuration Scheme FPGA (SRAM-based, external configuration) —
Hardware Crypto Accelerator Yes (AES, SHA - LS family feature) —
Series — Cyclone III LS
Family — Cyclone® III LS
Logic Elements — 198,464
Embedded Memory — 8,211,456 bits (8.21 Mbit)
Logic Array Blocks (LABs) — [DATA_NEEDED: exact LAB count]
Embedded Multipliers (18x18) — 396
User I/O Pins — 210
Number of PLLs — 4
Global Clock Networks — 20
Core Voltage — 1.2 V
Gehäuse — 484-ball FBGA (FineLine BGA), 23 x 23 mm
Temperature Grade — Commercial (0C to +85C TJ)
Bitstream Encryption — AES-128 (256-bit key via separate license)
Configuration Mode — Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG

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