EP3CLS200F780C7 vs EP3CLS200F780I7N Vergleich

Detaillierter Direktvergleich von EP3CLS200F780C7 von Altera und EP3CLS200F780I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS200F780C7 EP3CLS200F780I7N
Marke Altera Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $102,40 $240,00
Series Cyclone III LS EP3CLS200
Device Type FPGA - Field Programmable Gate Array —
Number of Logic Elements (LE) 198,464 —
Number of Logic Array Blocks (LAB) 8,212 —
Embedded Memory (Bits) 8,211,456 bit (7.83 Mbit) —
Maximum User I/Os 429 —
Gehäuse / Bauform 780-BGA, FBGA-780, 29 mm x 29 mm, 1 mm pitch —
Operating Supply Voltage (VCCINT) 1.15 V to 1.25 V —
Montagestil SMD/SMT —
Maximum Operating Temperature +70 C —
Minimum Operating Temperature 0 C —
Process Technology CMOS, low-power 65 nm CMOS (low-power)
Configuration Method SRAM, JTAG, Passive Serial, Passive Parallel —
Number of Transceivers 0 (no embedded high-speed transceivers) —
RoHS-Status Compliant Compliant (lead-free per FBGA-780 datasheet note)
Device Family — Cyclone III LS
Logic Elements — 198,464
Logic Array Blocks (LABs) — 12,404 LAB
Embedded Memory (bits) — 8,211,456
Embedded Multipliers — 425 (18x18)
PLLs — 4
Maximum User I/O — 413
Core Voltage (VCCINT) — 1.15 V to 1.25 V
Speed Grade — 7
Betriebstemperatur — -40 °C to +100 °C (industrial)
Maximum Internal Frequency — [DATA_NEEDED: maximum internal frequency MHz]
Gehäuse — 780-ball FBGA (FBGA-780)
Ball Pitch — 1.0 mm
Montageart — Surface Mount
Configuration Modes — Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG

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