EP3CLS70F484C7N vs EP3CLS100F484C7N Vergleich

Detaillierter Direktvergleich von EP3CLS70F484C7N von Intel und EP3CLS100F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS70F484C7N EP3CLS100F484C7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $96,30 $495,80
Device Family Cyclone® III LS —
Logic Elements (LE) 70,208 —
Logic Array Blocks (LABs) 4,388 —
Embedded Memory Bits 3,068,928 —
Maximum User I/Os 278 —
Maximum Operating Frequency 437.5 MHz —
Process Technology TSMC 65nm low-power (LP) 65 nm low-power (TSMC)
Core Supply Voltage (VCCINT) 1.2 V —
Package Type 484-ball FineLine BGA (FBGA-484) —
Package Dimensions 19 x 19 mm, 1.0 mm ball pitch [DATA_NEEDED: package body dimensions]
Montageart Surface Mount Surface Mount
Betriebstemperatur [DATA_NEEDED: commercial/industrial grade] —
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status Compliant (per Intel product page) Compliant (lead-free, N suffix)
Configuration Method JTAG / Passive Serial / Active Serial SRAM-based (volatile), via EPCS/JTAG/parallel flash
Design Tool Intel Quartus II (Cyclone III support) —
Family — Cyclone III LS
Logic Elements — 100,448
Embedded Memory (bits) — 4,451,328
User I/O Pins — 278
DSP Blocks (18x18 multipliers) — [DATA_NEEDED: DSP block count]
PLLs — 4
Global Clock Networks — [DATA_NEEDED: global clock count]
Core Supply Voltage — 1.2 V
Operating Temperature (junction) — 0°C to +85°C (commercial)
Speed Grade — C7
Gehäuse — 484-ball FineLine BGA (FBGA-484)
Ball Pitch — 1.0 mm
Security Features — Bitstream encryption, JTAG tamper protection
Design Software — Quartus II / Intel Quartus Prime

Datenblätter & Ressourcen

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